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AC'97简介:
    v2.2 specification



AGP 3.3V简介:
    Accelerated Graphics Port Specification 2.0



AGP PRO简介:
    Accelerated Graphics Port PRO Specification 1.01



AGP简介:
    Accelerated Graphics Port Specification 2.0



AMR简介:
    Audio/Modem Riser



AX078简介:
    



AX14简介:
    



BGA简介:
    Ball Grid Array



BQFP132简介:
    



EBGA 680L简介:
    



LBGA 160L简介:
    



PBGA 217L简介:
    Plastic Ball Grid Array



SBGA 192L简介:
    



TEPBGA 288L简介:
    



TSBGA 680L简介:
    



C-Bend Lead简介:
    



CERQUAD简介:
    Ceramic Quad Flat Pack



CLCC简介:
    



CNR简介:
    Communication and Networking Riser Specification Revision 1.2



CPGA简介:
    Ceramic Pin Grid Array



Ceramic Case简介:
    



LAMINATE CSP 112L简介:
    Chip Scale Package



DIMM 168简介:
    



DIMM DDR简介:
    



DIMM168简介:
    Dual In-line Memory Module



DIMM168简介:
    Pinout



DIMM184简介:
    For DDR SDRAM Dual In-line Memory Module



DIP简介:
    Dual Inline Package



DIP-tab简介:
    Dual Inline Package with Metal Heatsink



EIA简介:
    JEDEC formulated EIA Standards



EISA简介:
    Extended ISA



FBGA简介:
    



FDIP简介:
    



FTO220简介:
    



Flat Pack简介:
    



Gull Wing Leads 简介:
    



HSOP28简介:
    



ISA简介:
    Industry Standard Architecture



ITO220简介:
    



ITO3p简介:
    



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